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RM182X M.2 2280 AI Compute Co-Processor Module (20TOPS)

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RM182X M.2 2280 AI compute module, front view showing the RK1820 chip and M.2 gold fingers

RM182XMC0 (including RM1820MC0 and RM1828MC0) is a high-performance AI compute co-processor module supporting 3B / 7B large models (RM1820MC0 supports 3B, RM1828MC0 supports 7B), designed for AI inference and machine vision applications.

The module uses an M.2 Key M gold-finger connector and measures 22mm × 80mm. Customers only need to design a simple carrier board to integrate it into edge or embedded devices.

The core value

Large-model inference delivered as a standard M.2 2280 card. As long as your host has a free PCIe M.2 slot, dropping in one card adds 20 TOPS of local compute — no host replacement, no cloud round-trip.

Key specifications

  • Compute: 20 TOPS @ INT8
  • Data types: INT4 / INT8 / INT16 / FP8 / FP16 / BF16
  • CPU: 3× 64-bit RISC-V (SRV, VRV0, VRV1); VRV0/VRV1 include a 128-bit vector unit
  • On-chip DRAM: 2.5GB on RK1820, 5GB on RK1828, with hundreds of GB of bandwidth
  • Interface: M.2 Key M, PCIe 2.1, supporting both EP and RC modes and PCIe EP boot
  • Dimensions: 22mm × 80mm, 6mm thick
  • Power: carrier board must supply an additional 12V/3A; M.2 socket supplies 3.3V/3W
  • Operating environment: -10℃ ~ 55℃

Supported models

  • LLMs: Qwen 2.5 0.5B / 1.5B / 3B, Qwen 3 0.6B / 1.7B
  • Multimodal: FastVLM
  • Image classification: MobileNetV1, MobileNetV2, ResNet50V2
  • Object detection: YOLOv5s, YOLOv6s, YOLOv8s

Measured performance (input tokens: 128)

Model Mode TTFT (ms) TPS (tokens/s) Avg power Peak power
Qwen2.5 3B Power-save 144.455 54.537 5.35W 15.14W
Qwen2.5 3B Standard 96.05 77.945 7.2W 24.86W
Qwen2.5 7B Power-save 288.255 35.044 7.02W 16.11W
Qwen2.5 7B Standard 186.435 51.476 10.4W 27.28W

Software stack

  • RKNN3 Toolkit: PC-side development kit for model conversion and quantization
  • RKNN3 Runtime: on-device runtime API
  • RKNN3 Model Zoo: model conversion and deployment examples

Ordering information

Model Interface Description
RM1820MC0 M.2 Key M, PCIe2.1 Chip RK1820, supports 3B large models
RM1828MC0 M.2 Key M, PCIe2.1 Chip RK1828, supports 7B large models

Documentation

For the hardware specification and carrier board design guide (PCIe routing rules, 12V power design, thermal recommendations), visit the docs center: RM182X Documentation

Related reading

RM182X with black heatsink and blower fan cooling solution

RM182X module rear side component layout

Related Reading

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