LPDDR4X vs LPDDR5, eMMC vs UFS: How to Choose Memory and Storage
Everyone reads the CPU and NPU spec sheets, yet memory and storage are often treated as a matter of filling in a capacity. In reality, the same 8GB plus 64GB can del…
Everyone reads the CPU and NPU spec sheets, yet memory and storage are often treated as a matter of filling in a capacity. In reality, the same 8GB plus 64GB can del…
RK3588 and RK3588S are often treated as a high-end and low-end version of the same chip. They are indeed the same generation, with the same eight-core CPU (4×Cortex-…
Building a product on a system-on-module means handing the hardest parts — SoC, memory, storage — to the module vendor and designing only a carrier board. That saves…
One of the most underrated decisions at the start of a hardware project is whether to use a system-on-module or a single-board computer. Early on it looks like a que…
In the 2026 embedded and edge-computing market, the Rockchip RK3588 remains the benchmark SoC for high-end development boards and industrial mainboards. Built on an 8nm process, it integrates an octa-core 4×Cortex-A76 + 4×Cortex-A55 big.LITTLE architecture with a dedicated 6TOPS NPU, balancing general compute with on-device AI inference across commercial displays, edge gateways and AI vision […]
Turning a development board into a shippable device crosses the “deep water” of engineering. This article walks through certification, thermal design and supply chain — the practical path from prototype to mass production. 1. Certification First Industry-facing devices often require CCC, CE, FCC or similar. Reserve certification margin at the carrier-design stage (EMC filtering, grounding, […]
Hugsun’s 10-year core-board ODM playbook — PCB rework, Linux BSP, production testing and certification.
RK3588S SoM: all functional interfaces are routed to a DDR4 SO-DIMM edge connector for easy development and system integration.