Mini-PC Pitfalls: Five Traps Beyond the CPU
Memory speed, soldered storage, port de-specs, cooling and firmware support — the hidden scoring items.
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LPDDR4 vs DDR4: The Memory Choice Nobody Reads Past “4 GB”
Bandwidth, power, soldering and repairability — a board designer’s notes on memory trade-offs.
eMMC Longevity: Making Storage Last Five More Years
P/E cycles, write amplification and five settings that double flash life — long-termism for eMMC devices.
8K Content and Hardware: Who’s Pulling Whom
The spiral between 8K cameras, codecs and displays — an honest progress report on the content side.
The Rise of Domestic SoCs: A New Coordinate System for Embedded Buying
Rockchip/Amlogic/Allwinner portfolios, supply stability, and how sourcing strategy should adjust.
Android on ARM Development: Your First App on a Dev Board
From AOSP builds to board deployment, coping without GMS, and performance debugging that transfers to phones.
Edge-AI Market Watch: Four Certainties for 2026
NPUs as standard equipment to mature vertical solutions — four signs edge AI left the slideware stage.
RISC-V vs ARM: Will Five Years Change Embedded?
What an open ISA really means, RISC-V’s progress and gaps, and how embedded developers should respond.
The ARM Server Trend: From Data Centers to the Edge
Cloud ARM adoption, the efficiency economics and the knock-on opportunity at the edge.
Fanless Thermal Design: Surviving a 40°C Shop Floor
Heat-path design, vapor chambers vs fins — the engineering math behind going fanless.